ETP Cu is an oxygen-containing copper with very high electrical and thermal conductivity and excellent forming properties.
Material Cu-ETP | Cu | O | Bi | Pb |
min 99.90 | max 0.04 | max 0.0005 | max 0.005 |
Busbars, conductors, contacts, terminals, etc.
Conditions | Tensile strength Rm [MPa] | Yield strength Rp0.2 [MPa] | Elongation | Hardness |
Cu-ETP R200 | 220-260 | ≤140 | ≥33 | 40-65 |
Cu-ETP R240 | 240-300 | ≥180 | ≥8 | 65-95 |
Cu-ETP R290 | 290-360 | ≥250 | ≥4 | 90-110 |
Cu-ETP R360 | ≥360 | ≥320 | ≥2 | ≥110 |
Melting point | Density | cp@20°C | Coefficient of Thermal Expansion | Young modulus |
1083°C | 8.94g/cm³ | 0.394 kJ/kgK | 17.7 10-6 /K | 127 GPa |
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